Thermally conductive adhesives are suitable for bonding and sealing hybrid circuit substrates, semiconductor components, heat spreaders and other applications that demand broad design, flexible processing options and excellent thermal management. One part moisture-cure grades offer simple room-temperature processing to minimize costs. One or two-art heat cure solutions help to accelerate processing to speed time to market. 

Thermally conductive compounds, commonly called greases, serve as a thermal bridge that draws heat away from a device’s sensitive electronic components and dissipates it into the ambient environement. These no-cure materials offer relatively low cost, ease of application on heat sinks via screen rating and ease of rework. 

Thermally conductive encapsulants and gels come in a wide range of adaptable products for encapsulation and potting applications. The low viscosity before cure of these products enables them to process easily and fully embed tall components, delicate wires and solder joints. They are particularly suitable for managing high heat in complicated electronic module component architectures. (NOTE: Brochure refers to these as elastomers and gels – we’ve changed to encapsulants and gels to be consistent with product page title for these products.) 

Our dispensable thermal pads enable you to quickly and precisely dispense or print a layer of thermally conductive silicone compound in controllable thicknesses on complex substrate shapes, helping to ensure excellent thermal management and lower cost of ownership compared to prefabricated thermal pads.