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随着许多行业的设计师和制造商开发下一代产品，他们在努力满足不断变化的消费者需求时也面临着新的挑战。凭借多样的电子材料产品组合与全球技术专长，我们已准备好满足今天的需求，并与您合作一起应对未来的挑战。我们可以在整个电子价值链中帮助您实现更快的处理、更高的纯度、更高的导电率和更加可持续的解决方案。

  • 半导体、显示屏和印刷电路板应用：提供高纯度、低金属离子、质量一致的溶剂、胺、螯合剂和表面活性剂，适合光刻胶、彩色光阻、蚀刻剂、光刻胶剥离剂和稀释剂的应用 
  • 适合显示屏应用的有机硅解决方案：提供光学透明有机硅树脂 (OCR)，包括用于显示屏的紫外线固化和其他固化系统，用于显示屏热管理的有机硅热传导，以及装配和保护用的材料
  • 电子和高级模块/系统应用：为电子行业各个领域使用的电子模块、传感器和组件提供解决方案 – 包括有机硅和聚氨酯密封剂、粘合剂、导热和导电体、电磁干扰 (EMI) 传导体、保形涂料、凝胶，以及阻隔热量、水分、污染和振动的密封剂 
  • 能源应用：提供导热和冷却液，保护各种电子产品免受破坏性高温的影响 
  • 印刷电路板组件：提供凝胶和固定剂、导热材料、保形涂料和密封剂，以实现紧凑型设备，并帮助从敏感组件中排出热量 
  • 电池和电动交通应用：提供阴极、阳极、浆料、涂料、电解质、导热接口材料、泡沫、凝胶和组装材料，例如用于电池、逆变器、电动机、车载充电器和其他应用的粘合剂或密封剂

 

 

Latest Product Innovations: Electronics

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Thermal Management & Cooling
可折叠设备

DOWSIL™ VE-8001 弹性硅胶粘合剂

双组分弹性铰链胶粘接剂解决方案，适用于可折叠和可收卷商用设备的柔性OLED显示器。

July 2020

Blowout of automotive display module

DOWSIL™ VE-6001 UV-T  光学粘合材料

单组分、透明、低模量、低收缩、增强的紫外线稳定性、紫外线固化树脂，用于液体粘合技术产品。 

June 2019

Radar blowout

DOWSIL™ EC-6601 导电胶

单组分湿固化导电粘合剂，具有高伸长率和稳定导电性，专为电磁兼容性 (EMC) 而设计。

May 2019

Conformal coating designed for rapid in-line processing

DOWSIL™ CC-8030 紫外线湿气双重固化的敷形涂料

单组分、半透明、中粘度、紫外线湿气双重固化的涂料。

February 2020

Server Room with server towers

DOWSIL™ ICL-1000 Fluid

Immersing the cloud in sustainability with an innovative silicone liquid engineered to meet the demands of a dielectric coolant for immersion or spray cooling of data center servers.

February 2023

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DOWSIL™ TC-5628 Thermal Compound

Designed to maintain positive heat sink contact to improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device.

February 2023

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DOWSIL™ TC-5550 Thermal Conductive Compound

Created for the materials challenges in next-generation electronics technology. This silicone grease can be used in place of a PCM or thermal pad and was designed for bare die and lidless GPUs.

February 2023

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DOWSIL™ TC-3035 S Thermal Gel

Provides next-level cooling in high-performance electronics while delivering 4W/mK thermal conductivity, decreases chip temperature and improves power chip working efficiency.

February 2023

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DOWSIL™ TC-6015 Thermal Conductive Encapsulant

Developed to meet the demand across industries including renewable energy, energy storage, new energy vehicles and 5G stations for higher thermal conductivity materials.

February 2023

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DOWSIL™ TC-4083 Dispensable Thermal Pad

A 2-part thermal conductive gap filling gel providing excellent reliability and vertical stability after harsh aging testing to meet the demands of 5G technology and the environment.

February 2023

Thermal gel auto-dispensing

DOWSIL™ TC-3065 导热凝胶

一种单组分热固化有机硅基导热凝胶，具备优良的再加工性、低挥发性，帮助实现5G科技，并助力可持续发展。

July 2020

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DOWSIL™ TC-3015 可重工导热凝胶

陶氏最新的专利凝胶为智能手机和其他组件中的中央处理单元提供热管理。

August 2018

 

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计算机数控设备 PCB（印刷电路板），高科技工厂电子元件的生产

加工选择指南

探索能够实现电子元件加工的创新化学品
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新产品选购指南

为您的设备组装应用寻找合适的有机硅解决方案
ElectronicsWorld杂志封面

现代有机硅的重要性 （英语）

QA 与 Rogier 粘合剂一同探讨了现代有机硅对于电子产品的重要性

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