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最新产品创新:电子产品

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在这里,您可以找到有关我们新近推出的电子和系统装配应用的创新信息。  

可折叠设备

DOWSIL™ VE-8001 弹性硅胶粘合剂

双组分弹性铰链胶粘接剂解决方案,适用于可折叠和可收卷商用设备的柔性OLED显示器。

July 2020

导热凝胶自动分配

DOWSIL™ TC-3065 导热凝胶

一种单组分热固化有机硅基导热凝胶,具备优良的再加工性、低挥发性,帮助实现5G科技,并助力可持续发展。

July 2020

为高速在线加工设计的敷形涂料

DOWSIL™ CC-8030 紫外线湿气双重固化的敷形涂料

单组分、半透明、中粘度、紫外线湿气双重固化的涂料

February 2020

电路板和壳体分解图

DOWSIL™ VE-2003 UV 光学粘合材料

单组分、透明、低模量、低收缩、增强的紫外线稳定性、紫外线固化树脂,用于液体粘合技术产品。 

June 2019

电子设备和壳体分解图

DOWSIL™ EC-6601 导电胶

单组分湿固化导电粘合剂,具有高伸长率和稳定导电性,专为电磁兼容性 (EMC) 而设计。 

May 2019

电子设备部分截图

DOWSIL™ EG-4000 绝缘凝胶

高低温均稳定的凝胶,适用于-60°C至+ 200°C的连续操作,在215°C可持续3000小时。可用于高强度应力释放应用的软凝胶

March 2019

电子设备分解图

DOWSIL™ EA-4700 CV 粘合剂

通过新的配方技术,这种全新的先进装配解决方案不需要使用热固化炉,同时具有快速固化曲线和合理的开放时间。

March 2019

涂敷于电路板的凝胶特写

DOWSIL™ TC-3015 可重工导热凝胶

陶氏最新的专利凝胶为智能手机和其他组件中的中央处理单元提供热管理。

August 2018

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