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航空电子,航天与国防

想象一下未来的尖端科学(英语)

数十年来,我们一直关注天空,于 1943 年开发出第一款用于航空的有机硅。我们没有回顾。相反,我们会一直向前进。我们携手合作,为航空航天、国防和航空电子设备开发有机硅解决方案和服务,优化极端条件下的安全性、舒适度和效率。自从航空有机硅开发早期以来,发生了哪些变化? 我们已经将一个人送上月亮。飞机环绕全球。卫星较小,数量更多。存在无人机技术。无限可能,我们决心站在未来前沿。虽然时间已发生变化,但我们当时推出的产品仍被公认为行业标准。

为什么选择陶氏有机硅?

从火箭进入轨道、确保乘客在跨大西洋飞行中的安全,或让前沿防御技术保护我们的国家,陶氏有机硅一直静静地出现在整个旅程中。最需要时,飞行经过验证的解决方案意味着可靠性。有机硅的特性是耐臭氧,并且在各种温度、湿度和其他条件下保持自然稳定。这些特性结合深入的知识和一流的后向整合,使我们能够创建和调整所需的材料和性能特性,以满足当今的新兴需求。

 

航空电子、航空航天和国防解决方案

DOWSIL™ 粘合剂、密封剂和发泡材料可用于飞机、直升机和无人机的内部和外部,也可用作压缩机、变速箱和泵的垫圈。绿色强度即时粘合剂可粘合具有不同热膨胀率的基材,可用于当前和未来的空间模块设计。

DOWSIL™ 光学透明材料可耐受航空电子显示器和照明中的温度、湿度和其他极端环境。

DOWSIL™ 涂料,凝胶和密封剂可用于防御应用,以抵抗冲击和压力,以及抑制振动和提供良好的阻燃性。太空级密封剂可用于模块、继电器、电源、PCB和完整的电子组件。

SILASTIC™ 液态硅橡胶 (LSR)可用于航空电子、航空航天和国防市场,可提供出色的耐极端温度和抗老化性能。

DOWSIL™ 导热和导电材料为电子组件提供可靠的冷却解决方案,并对航空电子设备和传感器中各种频率的电磁干扰(EMI)具有高屏蔽效果。

快速链接

应用

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