电脑和移动设备材料 | 陶氏公司

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实现保持联系的未来

随着创新技术的快速发展，我们对手机、智能手表和其他设备的期望将更大。陶氏正在与消费电子、计算机和通讯设备的设计师合作，以增强多功能，并弥合尖端创新与久经考验的性能之间的差距。我们广泛的材料解决方案可以帮助提高产品耐用性和延长部件的使用寿命：

防止潮湿、振动和撞击
提供热管理和电磁兼容性
提高支持物联网的设备性能和更具成本效益的维修
防止数据丢失，同时降低功耗
使设备能够使用更长时间，防止设备废料进入垃圾填埋场

资源

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技术内容

满足5G需求
全新陶熙™ TC-4040导热垫助力5G，优化生产流程

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产品科技

粘合剂和密封剂

导电导热材料

弹性体和普拉斯托器

凝胶、封装胶和敷形涂料

润滑剂，导热油和航空除冰剂

塑料添加剂

特种聚合物和复合材料

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可重工的DOWSIL™ TC-3015 导热凝胶
R&D 奖入围者-适用于智能手机热管理

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