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微机电系统传感器和促动器

用于 MEMS 和高级半导体包装的有机硅解决方案

随着微电子变得越来越小、更薄和更复杂,对压力管理、耐用性和可靠性的要求也越来越具有挑战性。

陶氏有机硅混合、热熔和模具附着薄膜解决方案有助于优化 MEMS 和先进半导体包装的设计,推动新的创新,并满足严格的性能要求,包括热应力松弛、在宽广的温度和频率范围内保持稳定、低水分吸收、高纯度和可靠性。陶氏的硅基材料能够比环氧树脂和聚氨酯等有机物更有效地满足所有这些需求。

陶氏最新的 MEMS 和半导体封装有机硅解决方案

作为固化硅酮薄膜的模具附着膜,可为精确的厚度提供出色的均匀性,并消除环氧树脂粘合剂通常产生的片状和排放物。适用于典型半导体封装的模连接应用目标,尤其是 MEMS 传感器。

有机硅混合粘合剂以独特的配方将有机硅和有机物相结合。它们可提供增强的机械性能,而有机硅本身无法实现,如较高的模量和对各种表面的强力粘附力。它们还具有出色的光学特性。不发黄,适用于光模块应用的光柱至可靠性。

有机硅热熔以薄膜、滤筒和片剂的形式提供,可为各种基材提供出色的粘合力,并减轻应力,从而减轻翘曲。非常适用于半导体加工,如模具底部填充、软模具和封装。


DOWSIL™ 有机硅热熔薄膜技术  

了解有机硅有机硅热熔膜与液体有机硅相比的优势,包括更快、更轻松的工艺和减少热应力


DOWSIL™ 有机硅热熔滤罐技术  

与用于芯片封装和软成型的液体有机硅相比,了解用于压缩成型的有机硅有机硅热熔盒为何提供更好的适用性和热稳定性