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true

装配、双面和无基材胶带

装配、双面和无基材胶带 

有机硅压敏粘合剂 

如今的电子设备要求制造商在众多因素中平衡成本和性能,从粘合强度和电气性能到基材和加工参数。 陶氏提供创新的有机硅压敏粘合剂 (PSA),可为各种电子应用和环境优化性能。我们的有机硅PSA具有有机粘合剂无法匹敌的关键优势。

用于电子装配胶带的PSA

对于需要粘接、临时固定或可移动RFID标签的电子装配胶带应用,陶氏的PSA产品提供:

  • 出色的一致性 
  • 耐高温性 
  • 耐化学性 
  • 清洁可移动性 
  • 低迁移率 
  • 与PE、PI和PTFE背衬兼容 

用于无基材胶带和标签的PSA 

对于无基材胶带和标签应用,如表面改性、遮蔽胶带、零件粘合、汽车/电气标签或特种标签,陶氏的PSA解决方案提供:

  • 宽广的工作温度范围 
  • 防潮/防紫外线 
  • 对低能量表面的附着力 
  • 易于剥离性 
  • 与各种氟硅氧烷涂层的防粘衬里背衬兼容

快速链接

查找合适的解决方案(英语)
通过我们的有机硅PSA指南了解更多信息